Industrial and Commercial Bank of China Limited (1398.HK) vs Taiwan Semiconductor Manufacturing Company Limited (TSM)

See how Industrial and Commercial Bank of China Limited and Taiwan Semiconductor Manufacturing Company Limited differ across market data and performance, so you can decide which asset best fits your strategy.

$0.9968
HKSE
Industrial and Commercial Bank of China Limited is one of China’s largest state-controlled commercial banks. It provides corporate banking, personal banking, wealth management, payments, and treasury services through a broad domestic and international network. The bank serves major companies, public-sector entities, small businesses, and retail customers. Its results are influenced by Chinese credit growth, interest-rate spreads, asset quality, government policy, and the health of the country’s property, infrastructure, and industrial sectors.
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$439.51
NYSE
Taiwan Semiconductor Manufacturing Co. (TSMC) is the world’s largest pure-play semiconductor foundry, holding roughly 70% market share in 2025. Founded in 1987 as a joint venture between Philips, the Taiwan government, and private investors, the company listed in Taiwan in 1994 and later launched its US ADR in 1997. TSMC’s vast scale and advanced manufacturing capabilities support strong operating margins, even within the highly competitive foundry industry. The ongoing shift toward the fabless semiconductor model has also provided meaningful growth tailwinds. Its distinguished customer base includes Apple, AMD, and Nvidia, which rely on TSMC’s leading-edge process technologies for their chip designs. The company employs more than 83,000 people.
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Key Metrics Comparison

Industrial and Commercial Bank of China Limited1398.HK
Market Cap
$355.28B
Price
$0.9968
24h Change
+2.83%
24h Volume
$130.77M
Employees
409,758
Shares Outstanding
N/A
Taiwan Semiconductor Manufacturing Company LimitedTSM
Market Cap
$2.28T
Price
$439.51
24h Change
+0.60%
24h Volume
$8.01M
Employees
76,907
Shares Outstanding
5,186,505,000

Category Performance

Visual comparison across key categories. Ring fill represents relative strength or share between the two assets.

Market Share

Share of combined market cap

Market Share
1398.HK
13.5%
TSM
86.5%

Volume Share

Share of combined 24h volume

Volume Share
1398.HK
94.2%
TSM
5.8%

24h Performance

Price change over last 24 hours

24h Performance
1398.HK
2.83%
TSM
0.60%
Price Comparison
Industrial and Commercial Bank of China Limited
Taiwan Semiconductor Manufacturing Company Limited